The T650 is a film thickness gauge crafted with great care, featuring exquisite quality and high performance. It employs a micro - focused enhanced - type X - ray tube and digital multi - channel puls
全国服务热线： /
在线咨询High - order fully automatic performance film thickness gauge
The T650 is a film thickness gauge crafted with great care, featuring exquisite quality and high performance. It employs a micro - focused enhanced - type X - ray tube and digital multi - channel pulse signal processing technology. Meanwhile, it is equipped with a fully automatic moving platform and a zoom device. It can not only analyze the thickness of various plating layers but also analyze electroplating solutions. It is suitable for all kinds of extra - large workpieces, workpieces with irregular grooves, and small components requiring intensive multi - point testing.
It is widely used for quality control of various products, incoming material inspection, and measurement in the control of production processes.
1) Micro-focused highly integrated vertical optical path switching device: With the design of a cutting-edge optical path focusing system, it enables efficient, precise and stable detection of tiny measurement points.
2) Equipped with a zoom function, it can conduct non-destructive testing on various workpieces with irregular grooves. The depth range of the grooves is 0-85mm.
3) Equipped with a Si-pin detector, the minimum resolution can reach 129eV±5eV. It has excellent energy linearity and energy resolution, as well as higher stability and accuracy.
4) The detection accuracy and stability of the plating layer can be controlled within 5%.
5) Equipped with a fully automatic moving platform: A high-precision moving platform that can automatically, quickly and accurately position during multi-point detection.
6) Low cost of use: Low operation and maintenance costs, no vulnerable consumables, and relatively low requirements for the usage environment.
7) It can analyze solids and solutions; perform qualitative, semi-quantitative and quantitative analysis.
Instrument parameters
tems | T-650 |
Analysis Range of Coating and Plating Layer | Li（3）- U（92） |
Analysis Software | An independently developed enhanced FP algorithm enables fast, accurate, and stable testing of multiple layers and multiple elements. |
Software Operation | The intelligent analysis software allows one - key operation to automatically generate results. It can also automatically diagnose faults, provide correction prompts and operation steps, preventing incorrect operations. |
Analysis Time | 20 - 300 seconds |
Detector | Si - Pin semiconductor detector |
X-ray Device | High - stability micro - focused enhanced - type X - ray tube |
Collimator | Standard with Φ0.3mm (Choose one from Φ0.3mm/Φ0.2mm/Φ0.5mm) |
Signal Processor | It adopts the independently developed digital multi - channel technology to achieve the best peak - to - background ratio. |
High-voltage System | 0 - 50KV intelligent programmable high - voltage system |
Zoom Device | It can measure uneven and irregularly - shaped samples, with a zoom distance of up to 0 - 85mm. |
Sample Observation | It uses an industrial CCD high - definition camera for real - time observation. |
Focusing Method | High - precision manual focusing |
Magnification | 30 times optical magnification |
Moving Range of Z-axis | 170mm |
Size of the Sample Stage | 230*230mmm |
Movement of the Sample Stage | High - precision fully automatic moving platform |
Safety System | Multi - dimensional heat dissipation system and multiple radiation safety systems |
Other Accessories | One set of computer, printer, electroplating solution measuring cup (optional) |
Qualifications | Radiation safety production license; ISO9001:2015 Quality Management System Certification |
Application Areas
Non-destructive Testing
It does not damage or affect the service performance of the object being detected, nor does it harm the internal structure of the object being detected. The entire testing process is free of any damage.
Plating Layer Analysis
It can analyze the thickness of single-layer, multi-layer composite layers, alloy layers, and repeated plating layers, meeting the detection requirements of plating layers such as Au/Ni/CuZn, NiP/Al, ZnNi/Fe, Cr/Ni/Cu/CuZn, etc.
Applied Industries
It is widely applied in industries such as automotive parts, printed circuit boards, military industry, sanitary ware, electronic components, wires, connectors, aviation, etc.
Working Environment Requirements
Ambient temperature requirement | 15℃-30℃ |
Ambient temperature requirement | <70% |
Relative ambient humidity | AC 220±5V |
There should be no strong electromagnetic interference in the surroundings. | |
JPSPEC云顶4008最新网站公众号
4008云顶国际集团二维码
